X-Ray inspection of electronic assembly

Complex electronic circuit boards including both SMD (Surface Mounting Device) and traditional THD (Through Holder Device) components can be checked by X-Ray inspection using special machinery.

ME ELECTRONICS is able to perform non-destructive 3D and 2D high resolution X-RAY inspections by computer axial tomography. This powerful tool allows technicians to detect anomalies and defects in PCBs and mechatronic devices without damaging them.

At the request of customers, ME ELECTRONICS, supported by IPC and ESA qualified people, can perform in‑depth analyses of faulty devices to identify sources of problems.

Non-destructive X-RAY inspections are suitable for:

• validating devices and manufacturing processes (they can reveal some details not caught by visual inspection)
• preliminary tests before either performing destructive inspections or applying patches to circuits

The service can be also supplied for circuits assembled by third parties that mount complex components such as BGA.